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Korea-LAC Scholarship Program (KLSP)

The scholarship program aims to strengthen LAC countries¿ public sector workforces by improving targeted skills of mid-level public officials in the design, implementation and evaluation of public policies. The specific objectives include: improving the analytical and managerial skills of mid-level public officials, and facilitating an ongoing dialogue between public officials from B, C and D countries in the LAC region with representatives from Korean institutions and academia.

Project Detail

Country

Regional

Project Number

RG-T2579

Approval Date

June 25, 2015

Project Status

Closed

Project Type

Technical Cooperation

Sector

REFORM / MODERNIZATION OF THE STATE

Subsector

MANAGEMENT FOR DEVELOPMENT RESULTS

Lending Instrument

-

Lending Instrument Code

-

Modality

-

Facility Type

-

Environmental and Social Impact Category (ESIC)

Category C: Likely to cause minimal or no negative environmental and associated social impacts

Total Cost

USD 1,338,650.00

Country Counterpart Financing

USD 388,650.00

Original Amount Approved

USD 950,000.00

Can’t find a document? Request information

Implementation Phase
https://www.iadb.org/document.cfm?id=EZSHARE-2056220512-1060
Technical Cooperation Agreement
Agreement - Korea-LAC Scholarship Program (KLSP) Korea Development Institute [40828136].PDF
Jan. 28, 2017
English
https://www.iadb.org/document.cfm?id=EZSHARE-2056220512-3271
Technical Cooperation Agreement
Ammendatory Agreement No. 1 - Korea-LAC Scholarship Program (KDI).pdf
Oct. 17, 2017
English
https://www.iadb.org/document.cfm?id=EZSHARE-2056220512-3272
Technical Cooperation Agreement
Ammendatory Agreement No. 1 - Korea-LAC Scholarship Program (SKKU).pdf
Oct. 17, 2017
English
Other Documents
https://www.iadb.org/document.cfm?id=EZSHARE-73198828-2
TC Abstract
TC Abstract - RG-T2579 [39332707].PDF
Jun. 24, 2015
English
https://www.iadb.org/document.cfm?id=EZSHARE-100846814-11
TC Abstract
Safeguard Policy Report and Screening Form [39331333].PDF
Jul. 06, 2015
English

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